Features of electron-beam micro-sized processing of substrates made of various types of ceramics

Introduction

Outstanding mechanical and physical properties, such as high thermal resistance, hardness, and chemical stability, have contributed to the use of ceramics in many areas. In the electrical and electronic industry, ceramic materials are often used as substrates for electronic devices or modules, including for RF and microwave applications.

Currently, mechanical or laser processing is used to create holes in ceramics. Mechanical processing of ceramics leads to accelerated wear and chipping of tool edges. Laser processing results in conical holes and changes in material composition in the vicinity of the hole, significantly affecting the processing quality.

Electron beam processing (EBP) is a promising method due to its characteristics - high energy density, high efficiency, high stability, and others. This article examines the quality of electron beam processing of LTCC substrates and sintered VK94-DN ceramics in the process of hole drilling, depending on the electron beam parameters.

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Conclusion

Thus, when processing preheated sintered VK94-DN ceramics with a pulsed electron beam, a hole of the correct shape was obtained. The parameters of the pulsed electron beam (number of pulses, processing current, focus condition, pulse duration, and pause) influence the quality of ceramic processing. To obtain holes of smaller diameter during processing, a focused beam with lower processing current should be used.

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