Thick-film technology

Thick-film technology is a fairly common technology for applying thick layers for various purposes, due to the sintering of special pastes with a ceramic substrate. It is a very cheap and productive method that allows to obtain reproducible thick layers (from 8 microns) for various purposes.

The technological process consists of the following stages:

Application of a special paste on a ceramic substrate;
Heat treatment of paste;
Applying a protective layer.

This technology uses both conductive pastes used to form thick conductive layers, and pastes made of dielectric and semiconductor materials to form resistors and capacitors. Also, with the help of this technology, it becomes possible to apply thick insulating and protective layers. The paste is applied by screen printing or dispensers, both manual and automatic.
Heat treatment includes drying to remove the solvent from the paste and directly burning the paste into the ceramics. The protective layer is not applied for GIS installed in the housing. As a protective layer, glasses with a low softening temperature (no more than 500C) are used.

Specifications

Properties	Value
Resolution (conductor/gap), microns	от 44 до 200
Ceramics used	Al2O3 (ВК-94, ВК-96), AlN, BeO и etc
Pastes used	resistive, conductive, dielectric, polymer (protective)
Metallization thickness, mkm	от 8 до 100

Application area

thick - film GIS;
magnetic bearings.
solid-state relays;
thermoelectric modules;
various inductors;
ionizing radiation sensors;
sensors for liquid level, pressure, position, etc.;
solar collectors;
thick-film active and passive elements

Thick-film technology

Specifications

Application area

See also